Evaluating the Stability of Ceria Slurry for Polishing
Author Information
Author(s): Hwang Sohee, Park Jihee, Kim Woonjung, Meshkov Ivan B.
Primary Institution: Department of Chemistry, University of Hannam, Daejeon, Republic of Korea
Hypothesis
Using polymer dispersants with varying contents will minimize particle aggregation in ceria slurry during the chemical mechanical polishing process.
Conclusion
The D7 ceria slurry showed better stability and a higher removal rate compared to commercial ceria slurry.
Supporting Evidence
- The D7 sample exhibited smaller particle sizes compared to commercial ceria slurry.
- The stability of the D7 slurry remained consistent over three months under various temperature conditions.
- The D7 ceria slurry showed a slightly higher removal rate and better uniformity than the commercial slurry.
Takeaway
This study found that adding more of a special ingredient to a liquid used for polishing can make it work better and stay mixed for longer.
Methodology
Ceria slurry was prepared with different concentrations of a polymer dispersant and evaluated for stability and removal rate under various conditions.
Limitations
The study primarily focused on specific concentrations of polymer dispersants and may not account for all possible variations in slurry formulations.
Digital Object Identifier (DOI)
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