Copper Oxidation-Induced Nanoscale Deformation of Electromechanical, Laminate Polymer/Graphene Thin Films during Thermal Annealing: Implications for Flexible, Transparent, and Conductive Electrodes
2024

Copper Oxidation and Nanoscale Changes in Polymer/Graphene Films

publication Evidence: moderate

Author Information

Author(s): Croft Zacary L., Valenzuela Oscar, Thompson Connor, Whitfield Brendan, Betzko Garrett, Liu Guoliang

Primary Institution: Virginia Tech

Hypothesis

Residual stresses from spin-coating may influence polymer/graphene thin films and affect the thermomechanical properties.

Conclusion

Thermal annealing in air or vacuum degraded the mechanical properties of polymer/graphene laminate films due to structural deformations linked to the polymer's glass transition.

Supporting Evidence

  • Thermal annealing negatively impacts the mechanical reinforcement between PEI and SLG.
  • Deformation requires an oxidant-rich atmosphere and is mediated by the thermomechanical relaxation of the polymer.
  • Raman spectroscopy indicated a compressive strain in SLG after thermal annealing.

Takeaway

When heating special plastic and graphene films, they can get damaged if not done carefully, especially if the temperature is too high.

Methodology

The study involved fabricating PEI/SLG thin films via spin-coating and thermally annealing them to evaluate their mechanical properties.

Limitations

The study primarily focused on specific annealing conditions and may not account for all possible variations in polymer/graphene film behavior.

Digital Object Identifier (DOI)

10.1021/acsanm.4c06372

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