Abrasive Blasting Mechanism of Solder Welded 304V Wire in Vascular Intervention
Author Information
Author(s): Liu Yao, Zhai Shaobo, Guo Jinzhu, Fu Shiling, Shen Bin, Zhao Zhigang, Ding Qingwei
Primary Institution: North University of China
Hypothesis
The study investigates how different abrasive blasting parameters affect the removal of solder burrs from 304V wire used in vascular interventions.
Conclusion
The resin abrasive effectively removes solder while maintaining the integrity of the 304V wire, with air pressure being a significant factor in the process.
Supporting Evidence
- The resin abrasive can remove solder without damaging the 304V wire.
- Air pressure significantly affects the processing time and surface roughness.
- The alumina abrasive showed the fastest removal rate but caused more damage.
- Surface roughness increases with higher abrasive volume.
- Impact pits are the primary mode of material removal during abrasive blasting.
Takeaway
This study shows that using the right type of abrasive can help clean medical wires without damaging them, which is important for safe surgeries.
Methodology
Abrasive blasting experiments were conducted using various parameters like air pressure, lift-off height, abrasive volume, and type to analyze their effects on solder removal and surface properties.
Limitations
The study may not account for all possible abrasive types and their interactions with different wire materials.
Digital Object Identifier (DOI)
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