Simulation and Assessment of Thermal-Stress Analysis of Welding Materials in IGBT
2024
Thermal-Stress Analysis of Welding Materials in IGBT
publication
10 minutes
Evidence: moderate
Author Information
Author(s): Yang Yang, Chen Jibing, Liu Bowen, Wu Yiping
Primary Institution: Wuhan Polytechnic University
Hypothesis
How do different solder materials affect the thermal and mechanical performance of IGBT modules?
Conclusion
Nanosilver solder shows the best thermal and mechanical performance among the five solder materials studied.
Supporting Evidence
- Simulation results indicate that the highest temperature in the IGBT module occurs at the center of the chip.
- Nanosilver solder has the lowest maximum temperature among the five solder materials tested.
- The equivalent stress in nanosilver solder is higher, but it has a smaller elastic strain compared to other solders.
- Cavity damage at the edge of the solder layer has less impact on junction temperature than damage near the center.
Takeaway
This study looks at how different types of solder used in electronic devices can handle heat and stress, finding that nanosilver solder works the best.
Methodology
The study used ANSYS Workbench for thermal stress analysis simulations of various solder materials in IGBT modules.
Limitations
The study primarily focuses on simulation results, which may not fully capture real-world conditions.
Digital Object Identifier (DOI)
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