Bonding Diamond and Copper Composites Using Spark Plasma Sintering
Author Information
Author(s): Zhou Ying, Hu Daochun, Chen Minghe, Wu Taowen, Ouyang Jindong, Xiong Degan
Primary Institution: Nanjing University of Aeronautics and Astronautics
Hypothesis
The study investigates the effects of process parameters on the microstructure and mechanical properties of diamond/Cu composites bonded with a Cr interlayer using spark plasma sintering.
Conclusion
The optimal bonding conditions resulted in a defect-free interface with a maximum shear strength of 139.89 MPa and a thermal conductivity of 700.97 W/(m·K).
Supporting Evidence
- Shear strength increases with interlayer thickness up to a certain point, after which it decreases.
- Higher bonding temperatures and pressures reduce defects at the bonding interface.
- The bonding interface achieved a maximum shear strength of 139.89 MPa under optimal conditions.
Takeaway
This study shows how to effectively bond diamond and copper together to make them work better for heat dissipation in electronics.
Methodology
The study used spark plasma sintering to bond diamond/Cu composites with a chromium interlayer, evaluating the effects of interlayer thickness, bonding temperature, holding time, and bonding pressure on the bonding quality.
Digital Object Identifier (DOI)
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